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    Bruker SKYSCAN 1273

    Bruker SKYSCAN 1273 – High-Resolution 3D X-ray Microscope

    Bruker SKYSCAN 1273 is a high-capacity benchtop 3D X-ray microscope (XRM) designed for non-destructive investigation of large and complex samples. It provides detailed 3D visualization of internal structures without cutting or damaging the sample.

    The system combines a high-energy X-ray source of up to 130 kV with a large 6 MP flat-panel detector, enabling fast scanning and high-quality imaging. The 3D.SUITE software package provides reconstruction, 2D/3D analysis, and visualization of the acquired data.

    ADVANTAGES

    APPLICATIONS

    TECHNICAL SPECIFICATIONS

    Advantages

    • High-capacity benchtop 3D X-ray microscope (XRM)
    • Large sample capacity up to 250 mm diameter × 250 mm height
    • Supports samples weighing up to 20 kg
    • X-ray source up to 130 kV / 39 W
    • Large 6 MP flat-panel CMOS detector
    • Detector area of 140 × 230 mm
    • Fast scanning with scan cycles of less than 15 seconds
    • Non-destructive 3D visualization of internal structures
    • Helical Scanning for reduced artifacts in tall and elongated samples
    • HART Plus for up to 4× faster scanning of high-aspect-ratio objects
    • In-situ stages for mechanical and temperature experiments
    • No external water cooling required
    • 3D.SUITE software for reconstruction, analysis, and visualization

    Applications

    SKYSCAN 1273 is suitable for non-destructive quality control and materials research across a wide range of industries.

    Applications include additive manufacturing and 3D printing, medical devices and pharmaceutical packaging, batteries and energy storage, geology and petrochemicals, construction materials, and electronic components. It enables detection of internal defects, porosity analysis, dimensional inspection, and detailed material structure characterization.

    Technical Specifications

    Technology: 3D X-ray Microscopy (XRM)
    X-ray source: 40–130 kV, 39 W
    Detector: Active Pixel CMOS flat-panel, 6 MP (3072 × 1944)
    Detector area: 140 × 230 mm
    Maximum object size: 250 mm diameter × 250 mm height
    Maximum sample weight: 20 kg
    Dimensions: 1250 × 815 × 820 mm
    Weight: 450 kg
    Power supply: 100–240 VAC, 50–60 Hz, max. 3 A
    Software: 3D.SUITE, NRECON, DATAVIEWER, CTVOX, CTAN, CTVOL
    In-situ testing: Compression up to 4400 N; tension up to 440 N
    Temperature range: Up to 80 °C or 30 °C below ambient temperature

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