Bruker X4 POSEIDON

Bruker X4 POSEIDON – Modular Benchtop 3D X-ray Microscope

Bruker X4 POSEIDON is an advanced benchtop system for micro-CT and 3D X-ray microscopy (3D XRM), designed for non-destructive 3D imaging and analysis of the internal structure of samples. It combines a compact design, high scanning speed, and resolution down to 2 µm, with flexible configurations for different analytical requirements.

Its modular design allows users to select the X-ray source, detector, and sample stage according to their application. Multi-Vision technology enables the use of two different detectors to optimize the balance between speed, field of view, and resolution.

Category:

3D X-ray Microscopes

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ADVANTAGES

APPLICATIONS

TECHNICAL SPECIFICATIONS

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Advantages

Modular benchtop 3D X-ray microscope / micro-CT
Resolution down to 2 µm
Multi-Vision technology with two detectors
GEM Plus™ for an optimized balance of resolution, speed, and field of view
X-ray sources up to 100 kV / 20 W or 110 kV / 16 W
16 MP sCMOS detector for high-resolution imaging
7 MP flat-panel detector for fast scanning
Samples up to 110 mm diameter and 300 mm height
Optional automatic sample changer for 15 samples
4D-CT capabilities with mechanical and temperature stages
Easy operation with an intuitive user interface
3DxSUITE software for acquisition, reconstruction, visualization, and data analysis
Upgradeable configuration to meet changing application requirements

Applications

X4 POSEIDON is designed for a wide range of applications in materials science, industry, and life sciences. It enables non-destructive internal structure analysis, quality control, materials research, and failure analysis.

Applications include batteries and energy storage systems, electronic and optical components, composites, advanced materials, additive manufacturing, as well as various biomedical and biological samples.

Technical Specifications

Technology: Micro-CT / 3D X-ray Microscopy (3D XRM)
Reflection X-ray source: Up to 100 kV, 20 W; focal spot <5 µm at 4 W
Transmission X-ray source: Up to 110 kV, 16 W; focal spot <2 µm at 2 W
Detectors: 16 MP sCMOS (4096 × 4096); 7 MP flat-panel (2800 × 2400)
Maximum sample size: 110 mm diameter × 300 mm height
Resolution: Down to 2 µm
Automatic sample changer: 15 positions; up to 50 mm diameter and 80 mm height per position
4D-CT: Compression up to 4400 N; tension up to 440 N
Temperature testing: From 25 °C below ambient temperature up to 80 °C
Dimensions (W × D × H): 1250 × 604 × 690 mm
Weight: 350 kg
Power supply: 100–240 V AC, 50–60 Hz, max. 3 A
Software: 3DxSUITE