Bruker SKYSCAN 2214

Bruker SKYSCAN 2214 CMOS Edition – 3D X-ray Microscope at the Nanoscale

Bruker SKYSCAN 2214 CMOS Edition is an advanced 3D X-ray microscope (XRM) designed for non-destructive imaging and analysis of the internal structure of large and complex samples. It combines a wide range of sample sizes with high spatial resolution, enabling 3D imaging with a resolution below 500 nm.

The system uses an open-type nanofocus X-ray source up to 160 keV / 16 W and can be equipped with up to four X-ray detectors, allowing the field of view and resolution to be optimized for different sample types.

Category:

3D X-ray Microscopes

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ADVANTAGES

APPLICATIONS

TECHNICAL SPECIFICATIONS

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Advantages

Advanced 3D X-ray microscope (XRM)
Spatial resolution below 500 nm
X-ray source up to 160 keV / 16 W
Large 16 MP sCMOS detector
Up to 4 detectors
Pixel size down to 60 nm
Samples up to 300 mm in diameter and 400 mm in length
Maximum sample weight of 20 kg
Rotation positioning accuracy below 50 nm
Helical Scanning for reduced artifacts
HART Plus for up to 4× faster scanning of high-aspect-ratio objects
In-situ stages for materials testing and temperature experiments
3D.SUITE software for reconstruction, analysis, and data visualization

Applications

SKYSCAN 2214 is suitable for a wide range of applications in industry, materials research, and product development. It can be used for the analysis of batteries and energy storage systems, geological and petrochemical materials, construction materials, electronic components, metals, fibers and composites, as well as additive manufacturing.

It enables non-destructive analysis of internal defects, porosity, material structure, dimensions, and component distribution without the need for cutting or otherwise damaging the sample.

Technical Specifications

Technology: 3D X-ray Microscopy (XRM)
X-ray source: 20–160 kV, max. 16 W
Source type: Open-type nanofocus X-ray source with diamond window
Detectors: 6 MP flat-panel, 16 MP large-format CMOS, 16 MP mid-format CMOS, 15 MP high-resolution CMOS
Number of detectors: 1, 2, 3, or 4
Smallest pixel size: 60 nm
Resolution: <500 nm
Rotation positioning accuracy: <50 nm
Maximum object diameter: 300 mm
Maximum object length: 400 mm
Maximum sample weight: 20 kg
Dimensions (W × D × H): 1800 × 950 × 1680 mm
Weight: 1500 kg
Software: NRECON, DATAVIEWER, CTVOX, CTAN, CTVOL, 3D.SUITE
In-situ testing: Compression up to 4400 N; tension up to 440 N
Temperature testing: Up to +80 °C or 30 °C below ambient temperature